Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Suitable for practicing professionals as well as upper-level students in the areas of aerospace, mechanical, thermal, electrical, and systems engineering, Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments provides cutting-edge information on how to design, analyze, and test in the fast-paced and low-cost small satellite environment. It also presents techniques to reduce the design and test cycles without compromising reliability. Further, the book serves both as a reference and a training manual for designing satellites to withstand the structural and thermal challenges of extreme environments in outer space. It provides useful and practical approaches to solving the most complex thermal-structural problems ever attempted for designing spacecraft to survive the severe cold of deep space, as well as the unforgiving temperature swings on the surface of Mars.

• Provides updates throughout and includes an all-new chapter on Reliability.

• Includes case studies from NASA’s Jet Propulsion Laboratory, which prides itself in robotic exploration of the solar system, as well as flying the first CubeSat to Mars.

• Examines innovative low-cost thermal and power systems.

• Explains how to design to survive rocket launch, as well as the surfaces of Mars and Venus.